Communication networks provide the bedrock for digital transition of our society and economy. In 4G and 5G mobile networks, the Netherlands is strong in RF semiconductor technologies and applications of mobile technology. 6G, the new generation for the 2030s, offers large economic opportunities for the Netherlands to extend this position to areas in the global 6G value chain that have earlier moved to Asian and US companies. Securing such a position is crucial for the Netherlands to stay in control of its mobile networks. In the Future Network Services (FNS) program, leading ICT- and semiconductor companies and research institutions will jointly research specific parts of 6G: software antennas, AI-driven network software and leading 6G applications. By integrating these parts at the 6G software layer, FNS creates a powerful approach to make 6G a truly intelligent network. This innovation gives an important impulse to the Dutch economy and sustainable earning power, through advanced industrial activity and significant export opportunities. It will make 6G networks more energy efficient and drive digital autonomy.
Outline of the FNS-6G program:The FNS innovations are developed in four program lines: (1) intelligent components, developing software antennas for the new high (mm-wave and THz) frequencies in 6G; (2) intelligent networks, developing AI-driven software for 6G radio and core networks; (3) leading applications, developing new 6G applications in mobility, energy, health and other sectors that create value through new set-ups of the sector value chains; (4) ecosystem strengthening, integrating the FNS innovations in the national 6G testbed, stimulating start-ups and SMEs, developing and executing the human capital agenda and ensuring policy alignment. The consortium currently consists of a mix of 60 large and small telecom, semiconductor and ICT companies, universities and public bodies.
The PhD position 'Efficient multi-band InP mm-wave front-ends including integration possibilities with CMOS':So far wireless communications have experienced explosive growth. In last 30 years, through five generations of wireless systems, the data rates have been increased for couple of orders of magnitude. In addition, the wireless communications provide very broad content and support various applications. The 6G networks present next step in the development of wireless communications. The aim of 6G networks will be to improve data rates, reduce latency, contribute significantly to safety and finally combine communication and sensing systems.
In order to address these challenges the operating frequencies need to be increased to mm-wave portion of the frequency spectrum in order to allow usage of wide signal bandwidths. In addition, the devices will be required to operate at multiple frequency bands as well as to support different operating frequencies.
Using mm-wave carrier frequencies brings benefit in terms of signal bandwidth. Consequently, data rates in communication systems and resolution in sensing devices are improved. Nevertheless, it imposes a challenge in meeting the link budget requirements due to a large path loss. Conventional transmitter and receiver architectures designed and implemented in CMOS technologies will not be able to meet the link budget specifications. They provide limited gain, noise and output power capabilities at mm-wave frequencies. In addition, when using these architectures in the beamforming and MIMO solutions, they run into thermal and integration problems. An alternative is to use Indium Phosphide (InP) technology, which significantly improves performance of mm-wave circuits. Consequently, CMOS and InP chips need to be efficiently combined/integrated in order to maximize the integration level. This is essential for beamforming and MIMO solutions, particularly in the frame of multi-band operation.
The objective of this PhD project is the research into mm-wave transceiver architectures having in mind optimal distribution of building blocks between CMOS and InP chips as well as multi-band operation. Further, investigation has to be done into topologies of the mm-wave building blocks implemented in InP technology (power amplifiers, low-noise amplifiers, mixers) in order to maximize efficiency, minimize occupied chip area, enable multi-band operation and improve integration possibilities with CMOS. The options for integration need to be carefully investigated. The most promising one need to be selected from cost, robustness and complexity perspective. Finally, the scope of the prototype needs to be defined in such way that the proof of concept is demonstrated. The prototyping needs to include InP and CMOS chips, as well as integrated solution. The characterization of the prototype needs to be performed, and results have to be compared with simulations.
The main responsibilities of the PhD student will be:
- Conduct in-depth research on mm-wave transceiver architectures taking into account integration between CMOS and InP chips as well as multi-band operation. Propose the most promising architecture.
- Conduct in-depth research on integration technologies/solutions between CMOS and InP chips. Propose optimal integration technology/solution from cost, robustness and complexity perspective.
- Conduct in-depth research into mm-wave InP building blocks (power amplifiers, low-noise amplifiers, mixers). Propose the most promising topologies from efficiency, chip area and multi-band operation perspective.
- Define the prototype to prove the concept, design, fabricate and characterize the prototype.
- Conduct theoretical studies and simulations, verify/compare by characterization and testing.
- Contribute to the scientific community knowledge through high-quality publications.
- Prepare and defend the PhD thesis, which summarizes the results of the research.