- Design integrated modulators in the O-band and 2-µm band, from device level up to circuit level
- Translate designs into manufacturable layouts for internal and external PIC fabrication runs
- Conduct applied research with a focus on design-for-test and the aim to deliver functional building blocks for extending process design kits
InformationPhotonic integrated circuits - or optical chips - have evolved into a mature technology with a broad spectrum of use cases and a diversity of platforms and building blocks. The foundry model is now becoming established where Process Design Kits (PDKs) allow fabless designers to create their own chips with custom functionality. While most developments have previously focused on C-band, bandgap engineering allow indium phosphide photonic circuits to operate in other wavelength ranges. To fully exploit this potential, new photonic building blocks must be developed, including lasers, modulators, photodetectors, and passive components. Extending their operation to the O-band (1310 nm) and the 2-µm band will unlock opportunities in data center interconnects as well as a broad range of sensing applications in healthcare, agrifood, mobility, and others.
We are seeking a researcher to pioneer on-chip integrated modulators in both the O-band and 2-µm band. The work will begin at the device level (focusing on phase shifters) and progress to circuit-level designs (Mach-Zehnder modulators). Through applying a strong foundation in physics and engineering, you will design devices taking into account electrical, RF, thermal, and optical considerations. Key optimization targets will include energy efficiency (optical, electrical), footprint and speed. The building block developments will follow a rigorous design flow to result in functional elements for the photonic integrated platform. Close collaboration with colleagues is expected in PIC testing, compact model development, and PDK enhancement.
The position builds on the pioneering work in the foundry production of complex photonic integrated circuits in the JePPIX Pilot Line. The appointed person will work closely with a team of InP PIC technology experts at the Photonic Integration Technology Centre (PITC) and collaborate with integrated photonics researchers. The person is expected to produce PIC building blocks that are accessible to consortium partners. This new position is within the new Chips for Europe PIXEurope Pilot Line, which brings together InP PIC technology, silicon photonics, test automation and packaging within one technology agnostic design flow with Europe's leading research organisations.
Link for PIXEurope:
https://www.tue.nl/en/news-and-events/news-overview/05-12-2024-pixeurope-consortium-to-lead-the-european-pilot-line-on-advanced-photonic-integrated-circuitsLink for PITC:
https://pitc.nl