High-performance electronic and photonic technologies are rapidly converging, creating new opportunities for miniaturized sensors, imaging systems, and advanced communication devices. Integration of electronics and photonics is essential to achieve the energy efficiency, precision, and speed required for next-generation applications. While communications have traditionally driven this field, emerging applications in sensing, signal processing, metrology, lidar, and computing (quantum, neuromorphic, optical) are now shaping its future. Key technology trends include higher electrical modulation bandwidths, lower energy loss, robust circuits, increased integration density, and closer multi-technology integration.
InformationAs an Assistant Professor, you will:
- Develop innovative integration technologies that can combine advanced electronics and photonics for high-performance circuits.
- Conduct research in areas such as high-speed III-V component design, semiconductor epitaxial engineering, and fabrication of active components (e.g., diodes, HEMTs, HBTs).
- Explore methods for co-design and intimate integration of electronic and photonic devices.
- Build a new research line focused on the performance limits of chip-based circuits with applications in data centers, AI acceleration, 6G, radar, and sensor technologies.
- Contribute to TU/e’s educational mission by teaching MSc courses and strengthening the semiconductor lab flow, enabling students to design and fabricate their own chips.
- Supervise PhD, MSc, and BSc students and integrate challenge-based learning into teaching.
- Actively pursue research funding through national and European programs (e.g., Dutch subsidy, Horizon Europe, European Research Councial, Chips Joint Undertaking) and industry collaborations.
In this role, you will contribute to the ambition of the
Beethoven program to educate top talent and strengthen research across the fields of Science, Technology, Engineering, and Mathematics (STEM).