Short Description Are you interested in using fabrication methods to demonstrate novel photonic integrated circuits for a diversity of applications? We have two process engineer positions to carry out research and development activities for the next generation of integrated photonics technology in our state-of-the-art cleanroom facilities. One of the positions is focused on epitaxy and the other one is focused on fabrication of photonic integrated circuits.
Job Description The integrated photonics fieldPhotonics is widely regarded as the key enabling technology of the 21st century and its application and use in many scientific and industrial fields is accelerated through Photonic Integrated Circuits (PICs), which combine many optical components into a miniaturized chip format. Similar to electronic ICs, PICs are revolutionizing areas such as healthcare, communication and sensing and have the potential to be disruptive to the whole society. As the field matures, improving the performance and functionality of devices has a direct impact to broaden the application areas of PICs.
The positionsWe are currently in the consolidation phase of our unique 4' InP pilot line for manufacturing of InP photonic integrated circuits with cassette loading automation and wafer-level metrology capabilities. One of our recent key upgrades is a fully automated 4' MOCVD reactor for InP which has been installed in cooperation with AIXTRON GmbH. This state of the art tool enables unprecedented control of layer thicknesses, doping levels, material composition and contamination control. Other highlights include industry-grade plasma tools with in-situ metrology for precise patterning, a diversity of lithography tools (incl. DUV ASML scanner, direct laser writing, optical and e-beam). Alongside many other state-of-the-art tools, we are consolidating a best-in-class pilot line infrastructure, which will be the cornerstone for the development of InP photonics technology of the coming decade.
You will engage with researchers of the Photonic Integration (PhI) research group and the Photonic Integration Technology Center (PITC) to support research and development activities in European projects and in collaboration with industry partners of the
PhotonDelta ecosystem. The positions are for 2-years initially and possibilities for extension will be considered.
Position 1: Process Engineer Epitaxy
In this position you will collaborate closely with researchers of the PhI group to investigate layerstacks that are suitable for novel devices and circuits. In the beginning, the challenges will include the investigation of highly controlled doping profiles for optimization of waveguide propagation loss, as well as the study of selective-area dopant diffusion and the integration of multiple layerstacks on the same wafer through butt-joints, e.g. for active-passive integration. Further challenges will include custom layerstacks for devices (lasers, modulators and others). You will also be responsible for wafer metrology (incl. photoluminescence and XRD). You will collaborate closely with a senior epitaxy engineer. This position is covered by the EU-funded project INPHOMIR to perform research on PICs suitable for space applications.
Position 2: Process Engineer PIC Fabrication
In this position, you will engage in the fabrication of photonic integrated circuits in general (excluding epitaxy) by using several patterning techniques. Your activities will include both process-focused developments for improving PIC manufacturing, as well as execution of complete fabrication flows of integrated photonic circuits for particular applications proposed by researchers. You will be responsible for running full PIC fabrication, including lithography techniques, deposition and etching of materials via plasma processes, metallization and others. This position is covered by the National Growth Fund PhotonDelta program aim at the industrialization of integrated photonics.