PhD Multi-Material Deposition Techniques for micro-electronic applications
PhD Multi-Material Deposition Techniques for micro-electronic applications
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Functieomschrijving
AMSYSTEMS Center Ph.D. position:
Spatially Selective ALD: Multi-Material Deposition Techniques for micro-electronic applications.
Description
The AMSYSTEMS center is the joint innovation center of the Eindhoven University of Technology High tech Systems Center (TU/e-HTSC) and TNO, the Netherlands Organization for Applied Research. Our focus is to enable the next generation of manufacturing through innovative, additive approaches.
We offer a 4 year PhD position, aiming to break ground for multi-material, additive lithography based on directed self-assembly for future electronic applications. This project is theoretical/modeling/simulation based; the PhD candidate will join the theory group TPS in the department of applied physics at TU/e.
Background
Most current electronics devices (CPU's, logical circuitry, etc) are manufactured by structuring a resist layer using a lithographic process. The structured resist is used to partially etch away material, to create electronic components such as diodes, transistors, etc in a subtractive manner (material is removed to leave the desired structure). The process of masking and etching has limitations, and more complex structures require multiple layers, each consisting of multiple masking steps. This is a time-consuming and error-prone process, risking defective components and associated yield losses.
There is an alternative: in the additive manufacturing approach, material is deposited or grown, ideally only at the desired location. This bottom-up approach (direct creation of products from atomic- and molecular-scale components) includes technologies like chemical vapor deposition (CVD), molecular beam epitaxy (MBE), atomic layer deposition (ALD, but also dip pen lithography, nanoimprint lithography, and directed self-assembly.
Project
The PhD research will focus on ALD, a widely adopted atomic printing technology which forms a film by exposing a substrate to alternate gaseous species (referred to as precursors). The challenge is to make this technique spatially selective - to 'print' or 'write' on the substrate. A key challenge in such spatially selective ALD (ss-ALD) is spatial resolution: sub-micron is needed, but currently out of range. The central objective of this study is to asses the potential of highly localized periodic heating to push ss-ALD resolution across the micronic threshold.
You will perform analytical and numerical research to investigate the basic physics and chemistry of localized thermal ALD. Improving the resolution will require tailoring the thermal illumination protocol to the chemistry of the deposition reaction. You will develop a coarse grained model for the dynamic temperature profile in and on the substrate exposed to pulsed illumination during lateral translation, and you will couple these evolving profiles to a particle-based reaction-diffusion simulation on the surface to assess the aggregation of the deposited material.
Spatially Selective ALD: Multi-Material Deposition Techniques for micro-electronic applications.
Description
The AMSYSTEMS center is the joint innovation center of the Eindhoven University of Technology High tech Systems Center (TU/e-HTSC) and TNO, the Netherlands Organization for Applied Research. Our focus is to enable the next generation of manufacturing through innovative, additive approaches.
We offer a 4 year PhD position, aiming to break ground for multi-material, additive lithography based on directed self-assembly for future electronic applications. This project is theoretical/modeling/simulation based; the PhD candidate will join the theory group TPS in the department of applied physics at TU/e.
Background
Most current electronics devices (CPU's, logical circuitry, etc) are manufactured by structuring a resist layer using a lithographic process. The structured resist is used to partially etch away material, to create electronic components such as diodes, transistors, etc in a subtractive manner (material is removed to leave the desired structure). The process of masking and etching has limitations, and more complex structures require multiple layers, each consisting of multiple masking steps. This is a time-consuming and error-prone process, risking defective components and associated yield losses.
There is an alternative: in the additive manufacturing approach, material is deposited or grown, ideally only at the desired location. This bottom-up approach (direct creation of products from atomic- and molecular-scale components) includes technologies like chemical vapor deposition (CVD), molecular beam epitaxy (MBE), atomic layer deposition (ALD, but also dip pen lithography, nanoimprint lithography, and directed self-assembly.
Project
The PhD research will focus on ALD, a widely adopted atomic printing technology which forms a film by exposing a substrate to alternate gaseous species (referred to as precursors). The challenge is to make this technique spatially selective - to 'print' or 'write' on the substrate. A key challenge in such spatially selective ALD (ss-ALD) is spatial resolution: sub-micron is needed, but currently out of range. The central objective of this study is to asses the potential of highly localized periodic heating to push ss-ALD resolution across the micronic threshold.
You will perform analytical and numerical research to investigate the basic physics and chemistry of localized thermal ALD. Improving the resolution will require tailoring the thermal illumination protocol to the chemistry of the deposition reaction. You will develop a coarse grained model for the dynamic temperature profile in and on the substrate exposed to pulsed illumination during lateral translation, and you will couple these evolving profiles to a particle-based reaction-diffusion simulation on the surface to assess the aggregation of the deposited material.
Specificaties
- max. 38 uur per week
- Eindhoven Bekijk op Google Maps
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Technische Universiteit Eindhoven (TU/e)
Functie-eisen
Profile
We seek motivated candidates with a MSc. degree in theoretical or computational physics, materials science or mechanical engineering. You will have a greater chance of success if you can demonstrate programming and modeling skills (evidenced, for instance, by graduation research involving theory and modeling or proficiency with commercial multiphysics packages), and are excited about working in an interdisciplinary team at the interface between foundation and application. Full professional fluency in English is required.
We seek motivated candidates with a MSc. degree in theoretical or computational physics, materials science or mechanical engineering. You will have a greater chance of success if you can demonstrate programming and modeling skills (evidenced, for instance, by graduation research involving theory and modeling or proficiency with commercial multiphysics packages), and are excited about working in an interdisciplinary team at the interface between foundation and application. Full professional fluency in English is required.
Arbeidsvoorwaarden
We offer a fixed-term, 4 year position in a research group with an excellent reputation. Salary and benefits are in accordance with the Collective Labor Agreement for Dutch Universities, including: A gross monthly salary between EUR 2.222,- (first year) and EUR 2.840- (last year). Additionally, 8% holiday and 8.3% end-of-year annual supplements. A minimum of 41 holidays per year (excluding bank holidays, for a full-time employment of 40 hrs/week) Additional benefits, including excellent technical infrastructure, child care, holiday savings schemes, and sports facilities. Assistance for finding accommodation. Personal development program to develop your social and communication skills (see www.tue.nl/PROOF3TU).
