We are looking for a PhD-candidate to strengthen our highly motivated and multidisciplinary research team, who will work on laser-based manufacturing techniques for integrated electronic and photonic circuits, in the framework of a large Dutch project, titled ‘Groeifonds NXTGEN HIGHTECH’. This project is targeting groundbreaking developments in next generation high-tech equipment, to support growth and development of important Dutch high-tech sectors. Within the projects, knowledge institutes cooperate with relevant industry on novel solutions for societal challenges. The Background
Increasingly complex electronic and photonic circuit require equally advanced methods of connecting these circuits to the outside world. Laser-based methods can help in printing ever finer structuring required for bonding and assembly of these chips. Laser-induced forward transfer (LIFT) is an innovative Additive Manufacturing process in which a small volume (typically femto- to pico-litres) of a thin donor film is transferred to a substrate via a laser beam.
For examples of recent work done in this line of research, please refer to:
- Feinaeugle, M., Pohl, R. , Bor, T. , Vaneker, T. , & Römer, G-W. (2018). Printing of complex free-standing microstructures via laser-induced forward transfer (LIFT) of pure metal thin films. Additive manufacturing, 24, 391-399.Printing of free-standing microstructures
- Luo, J. , Pohl, R., Qi, L. , Römer, G. R. B. E. , Sun, C. , Lohse, D. , & Visser, C. W. (2017). Printing Functional 3D Microdevices by Laser-Induced Forward Transfer. Small, 13(9), . Printing Functional 3D Micordevices
- Miksys, J., Arutinov, G. , Feinaeugle, M. , & Römer, G-W. (2020). Experimental investigation of the jet-on-jet physical phenomenon in laser-induced forward transfer (LIFT). Optics express, 28(25), 37436-37449. Optica Publishing Group
During chip bonding, generally, the dimensions and properties of the bond and hence the conductive structures depend greatly on the properties of the metallic solder and the soldering method used. However, for integration of different chips in a same system, the density of these contacts is of major importance for the overall system footprint and cost. Due to the ability of the laser to focus energy in a very small volume, it is possible to transfer solder materials with a higher precision and possibly with improved material properties, while being a contactless method not requiring a cleanroom atmosphere.
In this project, you will investigate novel methods for laser-assisted soldering of circuit elements that can improve the assembly of heterogeneous systems of electronic and photonic chips. You will develop a setup to enable the laser-assisted transfer and analyse printed materials at the Chair of Laser Processing, contributing to the use of these materials in real integrated circuit systems to decrease the size of these features. This work will be carried out as a collaboration with knowledge institutes and companies within the consortium.
You will closely collaborate with researchers in other groups at the University of Twente and the industrial partners in the project. You will also have access to the renowned research facilities of the University of Twente.
If you are someone with a strong background in laser-material processing, preferably in ultra-short pulsed laser-material processing, material science, photonics or engineering, driven by curiosity, creativity, and dedication, we invite you to apply for this opportunity.