Are you interested in developing photonic integrated lasers suitable for efficient electro-optical performance when integrated in high densities? We have an open PhD position to carry out research on integrated lasers with device-level strategies aimed to mitigate performance deterioration due to thermal effects. The position is focused on technology development, however laser arrays for sensing applications will be pursued.
The integrated photonics fieldPhotonics is widely regarded as the key enabling technology of the 21st century and its application and use in many scientific and industrial fields is accelerated through Photonic Integrated Circuits (PICs), which combine many optical components into a miniaturized chip format. Similar to electronic ICs, PICs are revolutionizing areas such as healthcare, communication and sensing and have the potential to be disruptive to the whole society. As the field matures, improving the performance and integration density of photonic building blocks has a direct impact to broaden the application areas of PICs.
The PhD positionIntegrated lasers with uncompromised performance at high temperatures are key for future generations of monolithic and hybrid photonic integrated platforms. At device level, self-heating of lasers has a detrimental effect to the electro-optic energy conversion efficiency. At circuit level, thermal crosstalk effects often limit the maximum integration density of components. While active cooling is a solution for some cases, it increases the energy consumption and packaging costs.
By improving the thermal management of lasers and related active components, new possibilities are enabled, such as uncooled chip operation for applications where energy consumption is key, or high density PICs for applications where performance depends on the number of components. In recent years, we demonstrated the high-density integration of semiconductor optical amplifiers in a generic InP photonic integrated platform.
See F. Lemaitre, et.al., IEEE J. Quantum Electron, 28(6), 2022. In order to truly exploit such level of integration complexity for lasers, thermal effects need to be mitigated. Moreover, the use of PICs in harsh environments also calls for thermally resilient performance.
You will carry out research on InP-based integrated lasers that incorporate thermal management strategies from a design and fabrication perspective. The central approach will be to develop compact lasers with InGaAlAs quantum-wells as active material, alongside passive components. Additionally, Esaki tunnel junctions to minimize Joule heating due to current injection will be investigated. The successful integration of such features into active devices will contribute to more energy efficient and thermally resilient photonic integrated circuits.
The work will comprise device design (incl. semiconductor layerstack, optical, electrical and thermal simulations), photonic chip layout, cleanroom fabrication and chip characterization in our laboratories. You will be part of the Photonic Integration (PhI) research group and carry out the work in the framework of the Photonic Integration Technology Center (PITC) in collaboration with industry partners of the
PhotonDelta ecosystem.